Advanced公司有着30多年的连接器专业设计经验 , 并自家拥有多样化的生产设备及配件 , 可以创新设计高可靠的电子应用连接方案。跟竞争对手 , 与别不同。我司富经验的工程师与客户紧密联系 , 并能了解客户的应用要求 , 为客户提供专有的设计方案和高可靠性的快速样品。
生产各类插座及印刷板插针/插座，板对板连接器，IC插座和转换器，封装转换器，BGA插座:提供0.75至1.5mm间距,各种脚位均可订制
PGA插座:4至840位
PEEL-A-WAY(轻揭式):专利无座式设计, 方便安装节省空间
插针/插座:数百款标准或非标准插座
订制:插针/插座可按客户要求
Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages.
Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.
* Reduces costs associated with device package transition or obsolescence
* Lead-free device attach service provided
* Industry-proven solder ball terminal design provides the high reliability required in
medical, military, telecom, and automotive applications
* High temperature FR-4 adapter board closely matches original package size
* Same footprint as BGA device (currently available in 0.80, 1.00, and 1.27mm pitch)
* Custom designed to customer's requirements
* Tape and reel packaging available
端子:
Brass; Copper Alloy C36000, ASTM-B-16
Solder Ball: Eutectic 63Sn/37Pb
插座材料: High Temperature FR-4
产品资料:
BGA中介片数据表
参考连结:Contact Acceptance Range Data:
Typical Soldering Process Examples - Tin/Lead and Lead-free Generic Reflow Profiles
AIC_BGA_SolderProfiles_16A_rev0.pdf 
